What is the name of the machine that prints the production date on the plastic packaging What is the production date printed on the packaging bag   RFH UV laser is used for marking the date on food plastic packaging bags.   I often see many posts discussing on the Internet, "The production date is printed on the food packaged in plastic bags, and the date can be erased by hand in a few days. What is the reason?" or "What material is used for the outer layer of the plastic packaging, spray "The production date of ink can not be erased" and so on.

What is the name of the machine that prints the production date on the plastic packaging What is the production date printed on the packaging bag   RFH UV laser is used for marking the date on food plastic packaging bags.   I often see many posts discussing on the Internet, "The production date is printed on the food packaged in plastic bags, and the date can be erased by hand in a few days. What is the reason?" or "What material is used for the outer layer of the plastic packaging, spray "The production date of ink can not be erased" and so on.

What is the name of the machine that prints the production date on the plastic packaging What is the production date printed on the packaging bag   RFH UV laser is used for marking the date on food plastic packaging bags.   I often see many posts discussing on the Internet, "The production date is printed on the food packaged in plastic bags, and the date can be erased by hand in a few days. What is the reason?" or "What material is used for the outer layer of the plastic packaging, spray "The production date of ink can not be erased" and so on.

S9 UV laser uses PCB circuit board laser coding, long life and strong stability Nanosecond UV laser marking PCB QR code Solid-state UV laser cutting FPC circuit board   With the development of science and technology, the demand for smart products is increasing rapidly and becoming more and more popular. The representative one is intelligence, integrated communication, audio, and multimedia. In addition to powerful intelligent technology, its manufacturing process is becoming more and more sophisticated. Behind the thinner and lighter smartphones, there are high requirements for integrated hardware, such as circuit board integration and semiconductor chip integration. How to complete the manufacturing and processing of these integrated hardware? This has to be said, the classic version of the 355nm UV laser of the RFH brand.  

S9 UV laser uses PCB circuit board laser coding, long life and strong stability Nanosecond UV laser marking PCB QR code Solid-state UV laser cutting FPC circuit board   With the development of science and technology, the demand for smart products is increasing rapidly and becoming more and more popular. The representative one is intelligence, integrated communication, audio, and multimedia. In addition to powerful intelligent technology, its manufacturing process is becoming more and more sophisticated. Behind the thinner and lighter smartphones, there are high requirements for integrated hardware, such as circuit board integration and semiconductor chip integration. How to complete the manufacturing and processing of these integrated hardware? This has to be said, the classic version of the 355nm UV laser of the RFH brand.  

S9 UV laser uses PCB circuit board laser coding, long life and strong stability Nanosecond UV laser marking PCB QR code Solid-state UV laser cutting FPC circuit board   With the development of science and technology, the demand for smart products is increasing rapidly and becoming more and more popular. The representative one is intelligence, integrated communication, audio, and multimedia. In addition to powerful intelligent technology, its manufacturing process is becoming more and more sophisticated. Behind the thinner and lighter smartphones, there are high requirements for integrated hardware, such as circuit board integration and semiconductor chip integration. How to complete the manufacturing and processing of these integrated hardware? This has to be said, the classic version of the 355nm UV laser of the RFH brand.  

532nm green laser can avoid bursting when the silicon wafer is punched   The process of scribing and marking a silicon wafer is complicated, but for Ruifengheng Green Laser it is a simple task. The use of green laser marking in the production of Ruifengheng can contract a series of work, as long as you debug, scribing, cutting and marking all can be solved. In addition, the accuracy and smoothness of marking and cutting can be ensured. In marking, the characters and patterns can be clearly carved on the silicon wafer and not easily blurred.

The 532 Green Laser is the solution for scribing, cutting and marking silicon wafers.     The process of scribing and marking a silicon wafer is complicated, but for RFH Green Laser it is a simple task. The use of green laser marking in the production of RFH can contract a series of work, as long as you debug, scribing, cutting and marking all can be solved. In addition, the accuracy and smoothness of marking and cutting can be ensured. In marking, the characters and patterns can be clearly carved on the silicon wafer and not easily blurred.