3W,5W,10W uv laser

355nm UV laser has little thermal effect and is used for cutting silicon wafers

Feb 04 , 2021

RFH 355nm UV laser has little thermal effect and is used for cutting silicon wafers

Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed

RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology

Today, RFH Laser Editor introduces a very powerful material to everyone. Its element is the second most abundant element in the earth's crust, accounting for 26.4% of the total mass, second only to oxygen (49.4%); it can be seen everywhere in our daily lives and plays a very important role: it is the manufacture of semiconductor silicon devices , An important raw material for solar cells, is an indispensable material for aerospace, industry, agriculture and national defense. It is silicon.


Although the content of silicon is high, it mainly exists in the form of silicate or silicon dioxide, with very few elemental substances. Therefore, when cutting and processing silicon wafers, it needs to be very fine to reduce the consumption of elemental silicon raw materials. Currently, precision UV lasers are ideal equipment for cutting silicon wafers. Ultraviolet laser is well-known in the manufacturing industry for its "cold processing" characteristics, with low thermal impact, fine cutting "knife", and high cutting speed, which has several important conditions for silicon wafer cutting.


RFH's 355nm all-solid-state ultraviolet laser is a device that combines these characteristics well. It uses a unique laser cavity design, acousto-optic Q-switching technology and high-precision cooling system, small size, high integration; pulse width <20ns@40k, so the processing heat affected area is small; beam quality is superior (M2<1.2), Strictly guaranteed in all frequency ranges; perfect spot characteristics (spot ellipticity>90%). These parameters can remain consistent under extreme conditions in industry and scientific research.


Of course, for high-end industries such as silicon wafer cutting and processing, cutting quality alone is not enough, it must be efficient.


RFH This 355nm all-solid-state UV laser just has both cutting quality and cutting efficiency. The integrated design facilitates manufacturers to integrate equipment to suit various laser application control needs. It has a fully digital intelligent power control technology independently developed by RFH's professors and doctoral-level R&D team, which can update the power control system functional modules in time, and improve the functional modules according to laser requirements to maximize the performance of the equipment. Moreover, it supports communication with a computer, and can control the laser externally through RS232 to meet the needs of automated processing and production. Its excellence is all-round.


A good process makes a good silicon wafer, and a good silicon wafer makes a powerful country's microelectronics technology. RFH has worked hard for 12 years, and has achieved one after another first-class nanosecond lasers, which has won high recognition and good reputation from users in all walks of life, and has made important contributions to my country's efforts to become a powerful industrial manufacturing country.

Warm reminder: RFH 10-15W high-power ultraviolet laser will attend Sino-Pack in China International Packaging Industry Exhibition on March 4-6, 2020 and Shanghai Optical Expo in Munich on March 18-20

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