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Application of 355nm UV Laser in Diode Fine Marking

Oct 25 , 2022

Application of 355nm UV Laser in Diode Fine Marking

ICs, diodes, transistors, resistors and other small electronic product components are common objects for laser marking applications. Micron-scale small light spots can be used for high-precision micro-marking on these components, and laser marking is a permanent mark, which can meet the requirements of anti-counterfeiting and traceability. demand.

 

Before the application of laser marking, the manufacturers of these electronic components mainly used the method of spraying code or sticking to mark. These methods are not permanent, and they are easy to fall off and become blurred over time. After a large area is used, it is still difficult to read the small-sized QR code printed by printing, and compared with laser marking, the efficiency is low.

 

After the emergence of laser marking applications, fiber lasers, solid-state lasers, and CO2 lasers have played an important role in their respective fields for different material marking requirements. For fine marking of small electronic product parts, the "cold" processing characteristics of 355nm ultraviolet nanosecond solid-state lasers have attracted much attention, and marking on small electronic product parts is one of its main application scenarios.

The "cold" processing characteristic of 355nm UV light is that the bond energy of 355nm UV light is high, which can directly break the molecular bonds of the material. This separation leads to the separation of molecules and materials without generating heat and affecting the periphery of the marked surface. The material is regarded as "cold" processing, which is also one of the differences between the 355nm UV laser and other types of lasers. With a very narrow pulse width (<25ns), the degree of thermal influence is low, and the material itself can be protected from the pulse energy. of thermal damage.

 

The easy focusing characteristics and excellent beam quality (M2<1.2) of 355nm ultraviolet light make it have a very small focus after focusing, the minimum can reach ten microns, which is suitable for fine graphic marking of diodes, triodes, ICs and other components. , the minimum mark character height can reach 0.5mm, the mark line width is within a few tenths of a millimeter, and it is not a problem to mark a small two-dimensional code. The key point is that the marking quality is very high, the marking edge is clear, the transition is smooth, the overall resolution is high, and the scanning code recognition rate is high, which is convenient for tracking and tracing later.

 

 

Today, with the amazingly rapid development of large-scale and ultra-large-scale integrated circuit technology and applications, its industrial scale is increasing at a rapid pace, and the requirements for marking efficiency are also increasing. The excellent quality of the 355nm UV nanosecond laser, the advantage of not picking materials, and its high flexibility can be easily integrated into the production line to help improve the quality and efficiency of the production line and meet the requirements of mass production. A powerful assistant for the fine marking of products.

 

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To meet the market demand, RFH newly developed S9 series UV laser in 2020. Comparing with its kinds, S9 series UV laser features with rugged sealed cavity, extremely compact size, simple and robust, high stability, high efficiency, high reliability and excellent laser beam quality.Its compact design suggests no necessity in building big light path, which greatly reduces space and cost and makes it easy to be installed into UV laser marking machines. In addition, S9 series cavity structure is more stability and more excellent scalability, which means the same laser cavity can be produces multi-power lasers , and the stability of different power ranges is greatly improved.

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