Application of picosecond laser cutting machine in circuit board industry

  The principle of the picosecond laser cutting machine is to focus the laser light emitted from the laser into a high-power density laser beam. When the laser beam irradiates the surface of the workpiece, the workpiece reaches the melting point or boiling point, and the high-pressure gas coaxial with the beam will melt. Or the vaporized metal is blown away, and as the beam moves relative to the workpiece, the material will eventually form a slit, so as to achieve the purpose of cutting.

       The picosecond laser cutting machine has these characteristics in the circuit board industry: using high-performance green/violet lasers, good beam quality, small focused spot, uniform power distribution, and can process various high-complexity circuit boards, flexible circuit boards and Soft and hard board. By reducing the power by pulse, the PCB can be printed with two-dimensional code processing, realizing the dual purpose of cutting and coding. The cutting seam quality is good, the deformation is small, the appearance is smooth and beautiful.

       In addition to the application of the picosecond laser cutting machine on the circuit board, it is also suitable for other materials: the picosecond laser can complete the hole processing by percussion drilling and ensure the uniformity of the hole. In addition to circuit boards, picosecond lasers can also drill high-quality materials such as plastic films, semiconductors, metal films, and sapphire.