PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics and medical device manufacturers require close tolerances and minimal debris—this is where laser technology shines

TRADITIONAL VERSUS LASER DEPANELING

Mainstream depaneling methods utilize routers, die cutters and dicing saws. But as boards become thinner, smaller and more sophisticated, these methods expose PCB parts to mechanical stress—resulting in board breakage and lowering throughput.

Other challenges include:

Lower quality of cuts

PCB damage due to accumulated debris

Constant need for new bits, dies and blades

Not useful for boards < 500 µ

Design limitation—inability to cut complex, multidimensional PCBs