PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics and medical device manufacturers require close tolerances and minimal debris—this is where laser technology shines

TRADITIONAL VERSUS LASER DEPANELING

Mainstream depaneling methods utilize routers, die cutters and dicing saws. But as boards become thinner, smaller and more sophisticated, these methods expose PCB parts to mechanical stress—resulting in board breakage and lowering throughput.

Other challenges include:

Lower quality of cuts

PCB damage due to accumulated debris

Constant need for new bits, dies and blades

Not useful for boards < 500 µ

Design limitation—inability to cut complex, multidimensional PCBs

LASER CUTTING OF PCBS

Advantages

No mechanical stress

Lower tooling costs

Higher quality of cuts

No consumables

Design versatility—simple software changes enable application changes

Works with any surface—Teflon, ceramic, aluminum, brass and copper

Fiducial recognition achieves precise, clean cuts

Optical recognition improves product quality