15W green laser cutting LCP film and antenna material with high precision

LCP is a new type of polymer material, known as the "key material to choke the throat of 5G", and is widely used in the field of 3C electronics. At the beginning of its development, high-temperature resistant materials often used in microwave ovens. With the development of technology and the expansion of application fields, LCP has gradually entered people due to its high temperature resistance, high-strength mechanical properties, superior electrical properties and processing properties. The field of vision is gradually being applied to the scientific application of 5G.

LCP film, antenna material laser cutting process

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Common LCP products include electronic component connectors, antenna materials, production connection tubes and sensors, etc., which are widely used. With the advent of the 5G era, LCP as an antenna material has greatly increased the demand. Xiaobian today introduces a LCP material cutting equipment-laser cutting machine. In the 3C field, the cutting requirements for LCP are relatively high, and traditional cutting methods have gradually been unable to meet the increasing technological requirements. In order to seek the most technological progress, LCP laser cutting machine has entered people's field of vision and replaced the traditional cutting method.

What are the advantages of LCP green laser cutting machine cutting?

1. Non-contact processing: In laser processing, only the laser beam is in contact with the processed part, and no cutting force acts on the cut part to avoid damage to the surface of the processed material.

2. High processing accuracy and low heat influence: Pulsed laser can achieve extremely high instantaneous power, extremely high energy density and low average power, and can complete processing instantly with extremely small heat-affected area, ensuring high-precision processing and small heat-affected area .

3. High processing efficiency and good economic benefits: laser processing efficiency is often several times that of mechanical processing, and there is no consumables and pollution. The laser stealth cutting technology of semiconductor wafers is a brand-new laser cutting process, which has many advantages such as fast cutting speed, no dust generated during cutting, no loss of cutting substrate, small cutting path required, and complete dry process.