355nm UV laser cuts, drills, and scribes on glass wafers

RFH nanosecond UV lasers are well received in wafer cutting

RFH UV laser is a great technology for cutting/punching/grooving silicon wafers and silicon wafers

Wafer is the basic material used to manufacture IC. The silicon element is purified and made into long silicon ingots. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocrystalline silicon ingots through multiple procedures and cut to produce Made. The complicated manufacturing process and the unique nature of wafers have made wafer cutting, perforating and scribing technologies a problem that plagues many manufacturers.

The wafer production line operated by Mr. Zhang from Zhejiang is facing a complete replacement, so he came to the RFH headquarters to learn about the RFH ultraviolet laser, which is well-received in the industry.

In the dust-free production workshop, the UV laser, which is undergoing quality inspection, emits a small spot, which easily draws a shape on the prepared sample. The main ultraviolet light source can sensitively distinguish the processing parts marked in the design, the beam spot is uniform and dense, and the light transmission is quite superior.

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In addition, short pulses, high beam quality, peak power and other characteristics make the wafer material unnecessary to worry about material damage caused by overheating during processing, and realize the complete cutting of the wafer under different conditions.

In addition, the UV laser adopts laser non-contact marking technology and does not require additional consumable materials such as ink. It has considerable advantages in environmental protection, safety, reliability, and cost. It saves a lot for Mr. Zhang’s production line. A lot of money.

After the visit, Mr. Zhang was quite satisfied with RFH's S9 ultraviolet laser and quickly placed an order. Moreover, he commented: "Simple operation, ultra-stable quality, 0.02mm high precision, RFH UV laser is a very good auxiliary tool."

RFH S9 series ultraviolet lasers are smaller in size, more exquisite in design, and more stable in light output. The small and exquisite design means that users do not need to make a large light path, which can greatly reduce costs, save space, and be lightly installed in the field of flying marking equipment. The S9 ultraviolet laser is not only compact, but also has a more stable cavity structure and stronger scalability than similar products. The same cavity can produce lasers of multiple powers, and the stability of different power ranges is greatly improved.