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532nm green laser is used for micro-holes and blind holes on silicon wafers

Jun 08 , 2021

532nm green laser is used for the processing of micro-holes and blind holes on silicon wafers

Green laser solves the problem of high-precision marking of micro-holes and blind holes on silicon wafers

With a 532nm green laser, the marking of silicon wafers is clearer

The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the material of the quartz semiconductor for the manufacture of integrated circuits. After photolithography, grinding, polishing, slicing and other procedures, the polysilicon It melts and pulls out the monocrystalline silicon ingots, and then cuts them into thin wafers, which then become silicon wafers.

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The 532nm green laser produced by RFH can perform blind hole processing on silicon wafers, and can clearly pierce micro-holes at specified positions, maintain the efficiency and clarity of the wafer to the greatest extent, and the micro-holes are arranged neatly. It does not produce skewed and difficult-to-use effects, which is the best way to speed up production efficiency and quality.

Yesterday, Manager Zhou (from an integrated circuit company) just ordered three Expert Ⅱ 532nm solid-state green lasers for blind hole processing of silicon wafers and positioning and drilling of micro-holes.

"±0.02mm high precision", "high stability" and "high cost performance" are the core advantages of RFH green lasers

Expert Ⅱ532 green laser is a cold light source with small power heat affected zone, high beam quality, and fast marking speed. In addition, the ultra-high peak power and very few thermal effects are very suitable for wafer micro-cutting and drilling.

The Expert Ⅱ 532 series water-cooled green diode pumped pulsed solid-state laser (power range from 5W to 10W) ​​specially developed and produced by Seiko for 13 years has a wide range of repetition frequency, single pulse to 200kHz; strictly guaranteed in all frequency ranges With superior beam quality (M²<1.3) and perfect spot characteristics (spot ellipticity>90%), it is very suitable for ultra-fine marking; in addition, the pulse width of the green laser is <35ns@30k, and the heat-affected area is small during processing , There will be no scorching or deformation; and unique Q-switching control technology, suitable for various laser application control needs; adopting all-digital intelligent power control technology, simple operation and convenient remote monitoring.

 The core components such as the pump of the RFH green laser have always been imported brands, with a service life of more than 20,000 hours, while other parts also insisted on using domestic first-line brands to ensure that each component is purchased from the source of the ecological chain of materials quality.

What's more worth mentioning is that the domestic and foreign professor-level teams independently developed a power control system dedicated to green lasers, which can update the power control system functional modules in time and improve the functional modules according to laser requirements.

For 13 years, RFH has adhered to a complete sales model of "power supply + laser + cooling equipment" to fundamentally avoid problems such as laser power attenuation and uneven beam quality.

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