Advantages of Picosecond Laser Cutting FPC Copper Clad Laminate

Due to its short pulse width and high peak power characteristics, picosecond lasers have minimal thermal impact during processing, and are therefore widely used in the field of micro-nano processing. With the development of electronic products in the direction of miniaturization and lightweight, the market has further increased the requirements for FPC (flexible circuit board) integration. However, traditional processing methods cannot meet this integration requirement due to their own technical limitations.

The fpc material generally uses the substrate copper foil and polyimide or polyester film circuit board. According to the characteristics of the material, comprehensive cost performance and technical factors, the best laser cutting method is the ultraviolet picosecond laser cutting machine. Generally refers to the ultraviolet picosecond fpc shape laser cutting machine in the industry.

The picosecond laser cutting machine is characterized by fast cutting speed, neat cutting edges, smooth, no burrs, no glue overflow, high cutting precision, high yield, and high flexibility. This is also the main feature of the laser cutting machine replacing traditional processing methods in the fpc industry.