Advantages of UV laser cutting PI film

        With the development of laser technology, the use of UV laser cutting PI cover film gradually replaces the traditional die cutting. Ultraviolet laser cutting is a non-contact processing, no expensive molds are needed, and the production cost is greatly reduced. The focused spot can be only a dozen micrometers, which can meet the processing needs of high-precision cutting and drilling. This advantage is catering to the precision of circuit design. The development trend of chemistry is an ideal tool for PI film cutting.

        The current UV laser cutting machines used in PI film cutting are mainly nanosecond solid-state UV lasers. The wavelength is generally 355nm. Compared with 1064nm infrared and 532nm green light, 355nm ultraviolet has higher single photon energy and higher material absorption rate. The heat generated is less affected, and higher machining accuracy is achieved.

        In order to meet the PI film cutting industry's requirements for less carbonization and faster efficiency, the application of high frequency, narrow pulse width ultraviolet laser cutting machine is more efficient and advantageous.