Processing advantages of IC wafer semiconductor automatic laser scribing machine

       A larger share of the world chip dicing market, especially in the field of non-integrated circuit wafer dicing. The diamond saw blade (grinding wheel) dicing method is currently a common wafer dicing method. , The traditional blade dicing can easily lead to wafer breakage, and the dicing speed is slow, the dicing blade needs to be replaced frequently, and the later operation cost is high.

       The new dicing-laser, the laser is a non-contact processing, does not produce mechanical stress on the wafer, and has less damage to the wafer. Due to the advantages of laser focusing, the focus point can be as small as the sub-micron order, so that the microprocessing of wafers is more superior, and the processing of small parts can be performed; even at low pulse energy levels, it can be compared High energy density, effective material processing.

       Processing advantages:

       1. Laser scribing is a non-contact processing, which can avoid chip breakage and other damage;

       2. The high beam quality fiber laser used has little electrical influence on the chip, which can improve the dicing yield;

       3. The laser scribing speed is fast, up to 300mm/s;

       4. The laser can work on wafers of different thicknesses and sizes, with better compatibility and versatility;

       5. Laser scribing does not require deionized water, there is no problem of tool wear, and it can be operated continuously for 24 hours.