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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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uv lasers cutting plastic achieves precise, fast and repeatable cuts in many types of polymers
Apr 25 , 2021
Using lasers to cut plastic achieves precise, fast and repeatable cuts in many types of polymers. Compared to traditional cutting methods, laser systems offer many advantages like precise laser control, high accuracy and speed. Others include: Non-contact cuts. Lasers eliminate cleaning, sharpening and replacing cutting blades. Small kerf widths. Focused, localized laser energy creates very...
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RFH UV laser is especially suitable for laser lettering and typing on switch panel
Apr 26 , 2021
RFH UV laser is especially suitable for laser lettering and typing on switch panel In the old days, there were no marked buttons on the switch panel. We would find stickers or handwriting on the surface, which one is "on the light" or "off the light". This method is neither beautiful nor durable. However, since the popularization and application of ultraviolet laser technology in plastic sw...
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FPC flexible circuit boards need to use ultraviolet laser drilling, cutting, and scribing technology
Apr 27 , 2021
FPC flexible circuit boards need to use ultraviolet laser drilling, cutting, and scribing technology Our common mobile phones, TVs, computers, kitchen induction cookers, rice cookers, range hoods, chargers, remote controls and other electronic equipment all need FPC flexible circuit boards. When designing the corners of the FPC soft board, if the design is not right, the FPC flexible...
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uv Laser systems for wafer serialization, marking and scribing
Apr 27 , 2021
Semiconductor wafer processing typically requires serialization, patterning and roughening operations. And picking the correct laser system for these operations can be complex once you consider all the relevant process variables—such as substrate type, wafer diameter, feature size, slag tolerances, debris volume, throughput and clean room protocols. Whether marking or cutting wafers, lasers ...
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Permanent laser marks for industrial cables and wires
Apr 27 , 2021
Each year, billions of feet of cabling are installed around the world—requiring some kind of marking. Compared to other methods, laser wire marking offers unmatched precision, flexibility and speed without damaging the insulation or sheathing. THE ADVANTAGES OF LASER MARKERS Wire marks typically combine manufacturing information with product identification—though some additional marks ...
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CO2 Laser Marking Glass wafers,Weatherstripping,Electronic PCBs
Apr 30 , 2021
CO2 Laser Marking On this page, we explain marking examples and characteristics of CO2 laser markers, which are perfect for applications such as marking resin and paper or processing films. Applications Mechanism and Characteristics of CO2 Lasers Product Introduction Applications CO2 lasers have the longest wavelength of all commonly used lasers, more than ten times longer than that of stan...
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15W ultraviolet laser is used in PCB QR code laser drilling, cutting neatly and without burrs
May 02 , 2021
15W ultraviolet laser is used in PCB QR code laser drilling, cutting neatly and without burrs PCB circuit board is the support of electronic components and the carrier of electrical connection of electronic components. It mainly supports and interconnects. It is widely used in mobile phones, computers, remote controls and other electronic equipment. In the production process of PCB circuit ...
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Advantages of laser cutting
May 02 , 2021
This section introduces the principles and common problems of conventional die-based processing, followed by the advantages of using laser cutting instead. Conventional method: Press die construction Common problems with conventional die processing Advantages of laser cutting Utilising laser wavelengths for high-quality processing Conventional method: Press die construction Basic principles...
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Basic principles of cutting using laser markers
May 06 , 2021
Laser Cutting This section introduces laser processing-based laser cutting through examples. Basic principles of cutting using laser markers Laser cutting example — Laser cutting of electric wire coating Basic principles of etching using laser markers Etching example — Creating perforations on film Recommended models for laser cutting, organised by material Basic principles of c...
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High-power UV laser cutting technology to avoid PCB circuit board burrs
May 07 , 2021
High-power UV laser cutting technology to avoid PCB circuit board burrs In general, the surface of metal parts and the surface of small microscopic metal particles appear, these are called burrs. The more burrs, the lower the yield of PCB circuit boards. Causes of burrs: The cutting edge becomes dull and the gap is too large; the saw blade is dull or improperly installed; the punch is worn ...
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About Laser Cutting
May 12 , 2021
Laser Cutting Machines - What Will You Create? Epilog's CO2 laser cutting machines provide a wide range of opportunities and possiblities. The versatility, speed, and precision of Epilog's laser cutters enables makers, hobbyists, and entrepreneurs to produce everything from a simple machine concept to packaging to trophies & awards. Laser machines can cut wood, paper, plastic, fab...
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