Industrial application of infrared picosecond laser cutting machine

At present, the manufacturing industry has entered the "light" era. From nanoseconds, picoseconds, and femtoseconds, people's exploration of laser technology has never stopped. Ultrafast laser refers to a laser whose pulse time width is on the order of femtoseconds or picoseconds. It vaporizes materials instantaneously by virtue of its extremely high peak power. Compared with nanosecond lasers or continuous lasers, the thermal effect is minimal, and the processing edges are neat. It is very suitable for cutting and processing applications of mobile phone glass screens, sapphire, diamond superconducting materials and other products!

Picosecond laser cutting equipment is mainly used in mobile phone cover glass processing, LCD/OLED panel processing, ordinary glass processing, sapphire glass processing, PVD film peeling, cover film cutting, LCP/MPI high frequency material cutting, ceramic processing, wafer Cutting etc.

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This infrared picosecond laser processing system has a shorter pulse width and higher peak power, which can achieve better and finer processing results, realizing true cold processing, basically no carbonization, and gradually becoming the mainstream choice.