Picosecond laser marking machine for fine marking and cutting of mobile phone circuit boards

    In the manufacturing process of various components of smartphones, laser processing technology can be seen everywhere, such as mobile phone shell cutting, marking, welding, motherboard manufacturing, keyboard chip marking and engraving and punching of earpieces, earphones, accessories, and so on. In the marking process, we can use a nanosecond laser marking machine to achieve, but there are still certain shortcomings in the degree of refinement. The main reason is that the use of this kind of laser equipment for micro-machining and marking of mobile phones can easily impart more heat to mobile-related fine products, leading to melting, cracking, changes in surface composition, and other harmful side effects.

       However, with the picosecond laser marking machine, it is possible to achieve true athermal processing in the refined marking of mobile phones. In the actual marking process, picosecond laser equipment can be used to achieve high-speed, high-quality and refined marking on mobile phone related products, while nanosecond laser equipment is often difficult to achieve the same quality and is prone to various defects. The heating of the marking surface due to long nanosecond pulses causes a series of related problems, including raised edges, melting, chipping, and cracking or damage to the substrate.

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       In addition to avoiding heat-related defects, the use of current picosecond laser equipment can also improve processing efficiency. Picosecond laser equipment has a very short interaction time. Almost all energy is directly applied to the marked mobile phone parts and related products through laser pulses, which can achieve instant laser ablation and have high processing efficiency.