Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed

 As the "main force" of the global new energy development, the photovoltaic industry has been highly sought after by the market since its inception. In recent years, with the promotion of policies and the continuous cost reduction and efficiency enhancement of photovoltaic enterprises, photovoltaic parity has become a hot word.

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       In this context, the importance of laser processing, a key process for grid parity in the photovoltaic industry, is particularly prominent. As an industrialized tool, laser is a key technology in the photovoltaic industry. It can ensure a relatively low-cost manufacturing process to produce high-efficiency solar cells and obtain higher corporate benefits. In the photovoltaic industry, the most important aspect of photovoltaic production is battery manufacturing.

       Silicon cells play an important role in photovoltaic power generation, whether it is a crystalline silicon cell or a thin-film silicon cell. In crystalline silicon cells, high-purity single crystals/polycrystals are cut into silicon wafers for the battery, and lasers are used to accurately cut, shape, and scribe, make the battery and then string together. The use of laser to scribing and cutting silicon wafers is currently very advanced. It has high precision, high repeatability, stable work, fast speed, simple operation and convenient maintenance.