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Laser cutting and scribing processing of sapphire wafers

Jun 01 , 2021

Laser cutting and scribing processing of sapphire wafers

 As we all know, the LED chip as the core component of the LED lamp is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. The chip is encapsulated by epoxy resin. When sapphire is used as a substrate material and is widely used in the production of LED chips, traditional knife cutting can no longer meet the cutting requirements. So how to solve this problem?

 

 

       Using a short-wavelength picosecond laser cutting machine, sapphire wafers can be diced. This method effectively solves the difficulty of sapphire cutting and the LED industry's requirements for small chips and narrow cutting channels. It is an LED based on sapphire. Large-scale mass production provides the possibility and guarantee of efficient cutting.

 

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       Advantages of laser cutting:

 

1. Good cutting quality: Due to the small laser spot, high energy density and fast cutting speed, laser cutting can obtain better cutting quality.

2. High cutting efficiency: Due to the transmission characteristics of the laser, the laser cutting machine is generally equipped with multiple CNC workbenches, and the entire cutting process can be fully controlled. During operation, only by changing the numerical control program, it can be applied to the cutting of parts of different shapes, which can be used for two-dimensional cutting and three-dimensional cutting.

3. Fast cutting speed: The material does not need to be clamped during laser cutting, which can save tooling and fixtures, and save auxiliary time for loading and unloading.

4. Non-contact cutting: There is no contact between the torch and the workpiece during laser cutting, and there is no tool wear. Processing parts of different shapes does not need to change the "tool", just change the output parameters of the laser. The laser cutting process has low noise, low vibration and no pollution.

5. There are many types of cutting materials: For different materials, due to their own thermophysical properties and different absorption rates of laser, they show different laser cutting adaptability.

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