10W-15W uv laser
  • peeling paint and marking LOGO on the plastic
    RFH 355nm UV laser peeling paint and marking LOGO on the plastic surface of the shaver
    RFH 355nm UV laser peeling paint and marking LOGO on the plastic surface of the shaver Ultraviolet laser is a non-contact marking technology. Nowadays, when the development of traditional compliance technology is hindered and shows many shortcomings, the ultraviolet laser marking technology mastered by RFH can deliver new power to the marking process.
    peeling paint and marking LOGO on the plastic
  • marking date on olive oil bottle
    RFH Nanosecond green laser marking date on olive oil bottle
    RFH Nanosecond green laser marking date on olive oil bottle Olivilan olive oil is a product dedicated to the promotion and popularization of domestic Mediterranean diet culture and leading the quality of olive oil in the world. It has been working hard to maximize the nutritional value of olive oil for Chinese people. If you want to ask about Olivia's olive oil partners, you have to mention the RFH that marks the Olivia's bottle.
    marking date on olive oil bottle
  •  cut glass
    Malaysian Chinese customers buy high-power UV lasers to cut glass
    Malaysian Chinese customers buy high-power UV lasers to cut glass Glass is one of the most important materials in our daily life, whether it is used for windows, cabinets, utensils or works of art, it is a very good choice. Glass has many characteristics such as hardness, transparency, and fragility. Special attention should be paid to the cutting position and angle during use and cutting to avoid breaking and damage to it.    
     cut glass
  • scribing and etching thin film
    532nm green laser spot is suitable for scribing and etching thin film optoelectronic devices
    532nm green laser spot is suitable for scribing and etching thin film optoelectronic devices Thin-film optoelectronic devices are an inaccessible part of LCD panels. They are generally made of materials such as PET and PVC. They are made of materials with insulating effects and antistatic effects. And such a material, because of its lightness and thinness, requires very good technology to be able to cut.
    scribing and etching thin film
  • marking bulbs
    Singapore customers purchase RFH UV nanosecond laser marking bulbs for traceability and anti-counterfeiting
    Singapore customers purchase RFH UV nanosecond laser marking bulbs for traceability and anti-counterfeiting   Ultraviolet laser is a non-contact marking technology. Compared with the past technology, it has a great improvement. It completely avoids the defects of the past technology in principle and use, and reaches a very good level.
    marking bulbs
  • marking on the plastic surface
    Nanosecond UV laser marking on the plastic surface of HUAWEI P50 Pro mobile phone charger
    Nanosecond UV laser marking on the plastic surface of HUAWEI P50 Pro mobile phone charger   A few days ago, Huawei Ren Zhengfei's daughter Meng Wanzhou finally returned to China. On the day of her return, all the people celebrated the news. The performance and quality of Huawei's mobile phones have once again attracted attention.
    marking on the plastic surface
  • cutting PCB circuit board
    35W green laser Cold source cutting PCB circuit board at high speed, smooth and not deformed
    35W green laser Cold source cutting PCB circuit board at high speed, smooth and not deformed   PCB circuit boards are currently used in many electronic devices, whether it is the earliest red and white phones or today's Switches, smart phones, cameras, etc., they all play an important role in the architecture of the electronic circuits. The mass production of circuit boards requires full-page cutting of more entire circuit boards. In order not to damage the material, fine but high-speed cutting is required.
    cutting PCB circuit board
  • wafer scribing and dicing
    For wafer scribing and dicing, you need the sharp edge of the RFH UV laser
    For wafer scribing and dicing, you need the sharp edge of the RFH UV laser   Wafer is the basic material used to manufacture IC. It is made into long silicon ingots after purification of silicon elements. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocrystalline silicon ingots through multiple procedures, and then cut to produce Made. As an electronic component, it is used in many electronic products. The wafer area is usually small, so there is a high precision requirement in cutting and scribing.
    wafer scribing and dicing
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A total of 110 pages

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