Green laser is perfect for glass marking, thin film etching and surface treatment for most of the metals and non-metal materials, such as removing the oxide layer from the metal surface.
glass etching and engraving with 5w green laser
S9 series green DPSS laser, developed and produced by RFH, covers 5w/10w in laser power with short pulse width (<14ns@30K) ,superior beam quality (M²<1.2) and perfect laser spot quality (beam circularity >90%). It is particularly suitable for drilling and scribing in ceramics, marking, cutting and drilling in glass & wafer and surface treatment in most of the metal and non-metal materials.
Under the traditional punching technology, the glass with a thickness of 0.045mm is very easy to break during processing, and it can't meet the 2 micron hole diameter requirement required by customers, and this can be achieved by RFH. RFH green lasers drill holes on the surface of thin glass through nano-scale small light spots, and use ultra-high laser beams to impact, so as to achieve the purpose of production.
5w green laser source marking food packaging film
S9 series green DPSS laser, developed and produced by RFH, covers 5w/10w in laser power with short pulse width (<14ns@30K) ,superior beam quality (M²<1.2) and perfect laser spot quality (beam circularity >90%). It is particularly suitable for drilling and scribing in ceramics, marking, cutting and drilling in glass & wafer and surface treatment in most of the metal and non-metal materials.
10w green laser marking semiconductors with damage-free marking
S9 series green DPSS laser, developed and produced by RFH, covers 5w/10w in laser power with short pulse width (<14ns@30K) ,superior beam quality (M²<1.2) and perfect laser spot quality (beam circularity >90%). It is particularly suitable for drilling and scribing in ceramics, marking, cutting and drilling in glass & wafer and surface treatment in most of the metal and non-metal materials.
5w 10w green laser is applied for 3d glass etching
S9 series green DPSS laser, developed and produced by RFH, covers 5w/10w in laser power with short pulse width (<14ns@30K) ,superior beam quality (M²<1.2) and perfect laser spot quality (beam circularity >90%). It is particularly suitable for drilling and scribing in ceramics, marking, cutting and drilling in glass & wafer and surface treatment in most of the metal and non-metal materials.
10w green laser printing on glass bottles
S9 series green DPSS laser, developed and produced by RFH, covers 5w/10w in laser power with short pulse width (<14ns@30K) ,superior beam quality (M²<1.2) and perfect laser spot quality (beam circularity >90%). It is particularly suitable for drilling and scribing in ceramics, marking, cutting and drilling in glass & wafer and surface treatment in most of the metal and non-metal materials.
As a leading laser technology company in the south, RFH green laser has noticed the outstanding characteristics of liquid crystal substrate glass a few years ago, and entered into the interior of many enterprises to help them mark, engrave and cut liquid crystal glass substrates, etc. side operation.
At present, RFH green lasers have entered many domestic electronics factories for PCB panel cutting and production, and have a very important market position in East Asia, Western Europe and many regions and countries in Africa.
