10W-15W uv laser
  •  marking Adapter Laptop Charger
    355nm UV laser marking Adapter Laptop Charger has small spot and fine marking
    355nm UV laser marking Adapter Laptop Charger has small spot and fine marking   355nm UV laser is widely used in food packaging marking date, PCB/FPC circuit board engraving QR code, 3C plastic household appliances white-black printing logo or black-white printing logo, glass surface marking or internal carving, ceramic carving and other fields.
     marking Adapter Laptop Charger
  •  UV laser cold source marking
    S9 UV laser cold source marking adapter laptop charger
    S9 UV laser cold source marking adapter laptop charger 355nm UV laser is widely used in food packaging marking date, PCB/FPC circuit board engraving QR code, 3C plastic household appliances white-black printing logo or black-white printing logo, glass surface marking or internal carving, ceramic carving and other fields.  
     UV laser cold source marking
  • Marking PE plastic
    With Marking PE plastic, UV laser has high power stability and uniform beam quality
    With Marking PE plastic, UV laser has high power stability and uniform beam quality PE film can be used as the inner layer of food bags, clothing bags, composite bags, and packaging for cosmetics, pickles and pastries.   Because PE film is easily deformed by heat, it is necessary to use the ultraviolet laser which is the father of cold processing to mark the bar code or the production date on its surface
    Marking PE plastic
  • high-precision UV laser
    0.02mm high-precision UV laser is more suitable for printing date on PE film
    0.02mm high-precision UV laser is more suitable for printing date on PE film PE film can be used as the inner layer of food bags, clothing bags, composite bags, and packaging for cosmetics, pickles and pastries. Because PE film is easily deformed by heat, it is necessary to use the ultraviolet laser which is the father of cold processing to mark the bar code or the production date on its surface . The wavelength of the UV laser is 355nm, the beam quality is good, the focused spot is small, and the processing heat-affected zone is small.
    high-precision UV laser
  • marking mobile phone data line
    RFH nanosecond ultraviolet laser marking mobile phone data line
    RFH nanosecond ultraviolet laser marking mobile phone data line.  The outer layer of some current charging data cables is generally made of PVC series plastic material. If ordinary inkjet marking is used, the marked information and pattern are not strong and easy to be worn off; if laser is used, the laser power and other parameters should be strictly controlled, because PVC material has a low melting point, too much laser energy can easily burn the material. At present, ultraviolet laser is the main equipment in the data line marking processing market. The nanosecond ultraviolet laser supplied by RFH Company is one of the first-class marking equipment.
    marking mobile phone data line
  • marking USB Charger Cord
    355nm uv laser marking USB Charger Cord
    355nm uv laser marking USB Charger Cord The outer layer of some current charging data cables is generally made of PVC series plastic material. If ordinary inkjet marking is used, the marked information and pattern are not strong and easy to be worn off; if laser is used, the laser power and other parameters should be strictly controlled, because PVC material has a low melting point, too much laser energy can easily burn the material. At present, ultraviolet laser is the main equipment in the data line marking processing market. The nanosecond ultraviolet laser supplied by RFH Company is one of the first-class marking equipment.
    marking USB Charger Cord
  • Precision hole drilling in Silicon Wafers
    Precision hole drilling in Silicon Wafers, pls choose RFH green laser
    Precision hole drilling in Silicon Wafers, pls choose RFH green laser The 532nm green laser produced by RFH can perform micro-hole processing on silicon wafers, and can clearly pierce micro-holes at specified positions, maintaining the efficiency and clarity of the wafer to the greatest extent, and its micro-hole arrangement It is neat and does not produce skew and difficult to use effects, which is the best way to speed up production efficiency and quality.
    Precision hole drilling in Silicon Wafers
  • silicon wafer micro-hole drilling
    532nm green laser is used in silicon wafer micro-hole drilling
    532nm green laser is used in silicon wafer micro-hole drilling The 532nm green laser produced by RFH can perform micro-hole processing on silicon wafers, and can clearly pierce micro-holes at specified positions, maintaining the efficiency and clarity of the wafer to the greatest extent, and its micro-hole arrangement It is neat and does not produce skew and difficult to use effects, which is the best way to speed up production efficiency and quality.
    silicon wafer micro-hole drilling
1 ... 41 42 43 44 45 ... 82

A total of 82 pages

Get the latest offers Subscribe for our newsletter

Please read on, stay posted, subscribe, and we welcome you to tell us what you think.

Leave A Message
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.

Home

Products

About

contact