10W-15W uv laser
  • wafer scribing and dicing
    For wafer scribing and dicing, you need the sharp edge of the RFH UV laser
    For wafer scribing and dicing, you need the sharp edge of the RFH UV laser   Wafer is the basic material used to manufacture IC. It is made into long silicon ingots after purification of silicon elements. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocrystalline silicon ingots through multiple procedures, and then cut to produce Made. As an electronic component, it is used in many electronic products. The wafer area is usually small, so there is a high precision requirement in cutting and scribing.
    wafer scribing and dicing

A total of 1 pages

Get the latest offers Subscribe for our newsletter

Please read on, stay posted, subscribe, and we welcome you to tell us what you think.

leave a message
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.

Home

Products

About

contact