Precision hole drilling in Silicon Wafers, pls choose RFH green laser The 532nm green laser produced by RFH can perform micro-hole processing on silicon wafers, and can clearly pierce micro-holes at specified positions, maintaining the efficiency and clarity of the wafer to the greatest extent, and its micro-hole arrangement It is neat and does not produce skew and difficult to use effects, which is the best way to speed up production efficiency and quality.