Ultraviolet laser is a laser that produces ultraviolet beam, which is mainly divided into gas ultraviolet laser and solid ultraviolet solid laser.

Under the action of the pump source, the working medium is reached by absorbing the external energy. After the number of particles reversed by the number of particles is greater than the loss, the light is enlarged. Some of the enlarged light feedback continues to motivate to generate oscillations in the resonant cavity.

The gas medium mainly uses pulses or electron beam discharge. Through the mutual collision between electrons, the gas particles are excited from low energy levels to high energy levels to generate excitement to obtain ultraviolet laser.

The solid medium is an ultraviolet laser that radiates outward by a non -linear frequency crystal in a frequency conversion of one or above. Standards and all -solid -state ultraviolet laser are often used for laser processing and treatment. The classification of ultraviolet laser is shown in the table below.

There are many advantages in ultraviolet laser processing, which is also the first choice technology in the development of scientific and technological information. First of all, ultraviolet laser can output ultra -short wavelength laser, which can accurately handle ultra -small and fine materials; secondly, the "cold treatment" of ultraviolet laser will not destroy the material itself as a whole, but it is processed on its surface; there is basically no heat damage effect; some materials have some materials; The visible light and infrared laser cannot effectively absorb the irreplaceable process. The advantage of ultraviolet is that basic materials are widely absorbed by ultraviolet light. UV laser, especially solid ultraviolet laser, has a compact structure and small size, simple and easy to maintain, and easy to produce. UV laser is widely used in processing medical biomedical materials, criminal case evidence collection, integrated circuit board, semiconductor industry, micro -light component, surgery, communication and radar, laser processing cutting very widely.

Change the surface characteristics of biological materials

In some treatments, many medical materials need to be compatible with human tissue, or even repair, such as ultraviolet laser treatment of internal diseases and rabbit corneal experiments. Sometimes they need to change biomromes characteristics and macromolecular structures. For good pulse parameters, the experiments will use 100 nm, 120 nm, and 200 nm to illuminate the surface of the medical biological materials to improve the physical chemical structure of the surface of the material, and does not change the overall chemical structure of the material. , Make the processing organic biological materials and human tissue compatibility and hydrophilicity significantly improved, and it is very helpful in medical and biological applications.

Criminal investigation

In the field of criminal investigation, when it is found that fingerprints have a unique characteristics as DNA, fingerprints can be printed as an important biological certificate left by criminal cases as criminal cases.

The old method can cause sample damage, and it is difficult to collect and store evidence. The current research is based on the surface fingerprints of non -permeability objects, such as tape, photos, and glass. "Ultraviolet Lighting Imaging Technology" and "UV laser reflection imaging technology", that is, the potential fingerprints of ultraviolet laser irradiation with a wavelength of 266 nm, observed and recorded UV lasers through 266 nm and 340 nm pass filter lights, respectively Test and adopt collection.

70 percent of the 120 experimental samples in the experiment can be successfully tested. UV short wave technology has improved the success rate of potential fingerprints, and it is convenient and fast and easy to control its optical characteristics. It has a large application prospect in the field of court science. UV detection can be detected by common biological tests such as salivary spots, shedding cells, blood stains, and hair follicles.

However, the ultraviolet laser with a short wave 266 nm at a fixed distance is analyzed through the long -ray biological examination materials at different times to analyze the DNA for analysis. It was found that the ultraviolet laser of short wave 266 nm was seal, blood stains, saliva, shedding cells, and hair follicles. 5 common types of hair. The results of the DNA test of biological evidence have a serious impact, but the detection of biological DANs such as hair follicles, body fluid saliva, and blood spots on hair has only a small number of biological DAN.

Short -wave ultraviolet laser will have an impact on some DNA biological examinations, so when the criminal investigation survey is obtained, it is necessary to carefully choose the extraction method based on evidence.

Application of UV laser on the integrated circuit board

In the production process of a variety of circuit boards in the industrial field, from the beginning of wiring to the production of micro -precision embedded chips that require advanced technology, the flexible circuit, polymer and copper layer circuit in the integrated circuit board need Drilling micropores and cutting, including the repair and detection of materials on the circuit board, often need to be used for fine processing and processing. Laser micro -processing technology in circuit board processing is obviously a better choice.

During the processing process of laser, the working machine does not contact the processed product, effectively avoids mechanical force, rapid processing, high flexibility, and no special requirements for working occasions. The following magnitude.

The more traditional drilling method on the circuit board is to use ultraviolet laser and CO2 laser for non -metal marking (CO2 laser with a wavelength of 10.6 μm for non -metallic material marking; wavelength 1064 nm or 532 nm is generally used for metal metal Material marking).

At present, ultraviolet laser machining technology can be used, which can achieve micron -level processing, high accuracy, can make ultra -fine zero devices, and can be applied to laser beams with less than 1 μm spots.

However, the CO2 laser mainly hit the holes of 75 ~ 150 mm, and the small holes are prone to misplaced, while ultraviolet laser can hit holes of less than 25 mm, high accuracy and not misplaced.

Processing and preparation of microcomioxito device

In the information age of the rapid development of science and technology and modern industries, to build more experimental systems in smaller space and achieve more functions, it is necessary to speed up the development of information technology. Small, miniaturized, and only complete device processed on the surface chemical keys of the material.

It has important application and research value in the fields of military radar communication, medical treatment, aerospace and biochemistry. It can be deepened and optimized, and developed on nano -scale micro -optical elements to transform traditional optical components' functions and characteristics.

Micrological components have the advantages of easy mass production and easy realization of formation, and simple and light and flexible, but its main materials are quartz glass.

In the process of application and treatment, quartz glass is easy to produce cracks and pit, which is a hard and brittle material, which greatly weakens its optical properties.

Therefore, the direct writing "cold" processing technology of ultraviolet laser improves the efficiency of microdegenene device, quickly completes the processing of micro -light components with high -precision micro -structures and does not hurt the material. It can flexibly complete the processing of different needs of large size.

Foreign scientific research institutions have studied the earlier research of ultraviolet -ultraviolet processing silicon wafers, and then they started to study the cutting technology and cutting surface of the silicon wafer cutting technology later.

Application of UV laser in the semiconductor industry

In recent years, ultraviolet laser has attracted more and more attention to micro -processing of semiconductor materials. Thousands of dense circuit components are very common in integrated circuits, so some high -precision treatment and processing methods are needed. There are also some high -quality instruments and devices such as semiconductor materials such as semiconductor materials such as silicon and sapphire. UV laser and study the spectral characteristics of the film. At the same time, ultraviolet laser can also increase the utilization rate of silicon materials, and it can also change the micro -structures of the silicon surface, which is conducive to the development of solar panels, such as two -dimensional micro -light grids, etc. Essence

Through these decades of development and research, the technology and applications of ultraviolet laser are becoming more and more extensive and mature. It has a fine "cold" processing technology that does not change the physical properties of the object while performing micro -processing and processing on the surface. Widely used in various industries and fields such as communication, optics, military, criminal investigation, and medical care.

With the emergence of more and more new types of frequency crystals and gain media, the shorter the ultraviolet laser with the shorter wave length, the higher the power of the ultraviolet, will be applied to more industries in the future, promoting the development of various industries, and the ultraviolet laser in the field of processing is even more Intelligence, efficient, accurate, high repetition, and high stability are the trend of future development.