35W green laser is used for the processing of micro-holes and blind holes of silicon wafers. Mr. Lin from an integrated circuit company, after learning about the performance of RFH green laser in the processing of micro-holes and blind holes on silicon wafers, drove to RFH for field trips.

532nm green laser engraving glass, drinking glasses and mirrors   Glass is more and more widely used in our lives. Whether it is optical glass, ordinary glass or glass craftsmanship, it is inseparable from punching and cutting technology.

In the realm of semiconductor manufacturing, intricacies abound, with the drilling of silicon wafers taking center stage. As technology advances, the demand for more precise and efficient drilling methods escalates, leading to the emergence of a transformative solution: the water-cooled UV laser source. This cutting-edge technology has revolutionized the industry, offering unparalleled power, accuracy, and reliability, elevating the art of silicon wafer drilling to new heights.